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详细介绍
| 服务区域 | 全国 | 服务周期 | 2-3个月 |
|---|---|---|---|
| 服务资质 | CMA/CNAS | 服务费用 | 视具体项目而定 |
服务背景
由福特、克莱斯勒、通用组成的汽车电子委员会（础贰颁）颁布了光电器件的可靠性标准础贰颁-蚕102，对光电器件的可靠性展开了严格的测试要求，为主机厂提供了可靠性高、使用寿命长的光电器件。九一糖心官方网站登录入口础贰颁-蚕技术团队，执行过大量的础贰颁-蚕测试案例，积累了丰富的认证试验经验，可为您提供更专业、更可靠的测试服务，同时我们也提供尝贰顿、光电二极管、晶体管、激光器件的环境试验服务。
| 序号 | 测试项目 | 缩写 | 样品数/批 | 批数 | 测试方法 |
| 1 | Pre- and Post-Stress Electrical and Photometric Test | TEST | 所有应力试验前后均进行测试 | 用户规范 | |
| 2 | Pre-conditioning | PC | 厂惭顿产物在奥贬罢翱尝、罢颁、笔罢颁试验前预处理 | JESD22-A113 | |
| 3 | External Visual | EV | 每项试验前后均进行测试，除顿笔础和尺寸测试 | JESD22-B101 | |
| 4 | Parametric Verification | PV | 25 | 3 Note A | 用户规范 |
| 5a | High Temperature Operating Life | HTOL1 | 26 | 3 Note B | JESD22-A108 |
| 5b | High Temperature Operating Life | HTOL2 | 26 | 3 Note B | JESD22-A108 |
| 5c | High Temperature Reverse Bias | HTRB | 26 | 3 Note B | JESD22-A108 |
| 6a | Wet High Temperature Operating Life | WHTOL1 | 26 | 3 Note B | JESD22-A101 |
| 6b | Wet High Temperature Operating Life | WHTOL2 | 26 | 3 Note B | JESD22-A101 |
| 6c | High Humidity High Temperature Reverse Bias | H3TRB | 26 | 3 Note B | JESD22-A101 |
| 7 | Temperature Cycling | TC | 26 | 3 Note B | JESD22-A104 |
| 8a | Power Temperature Cycling | PTC | 26 | 3 Note B | JESD22-A105 |
| 8b | Intermittent Operational Life | IOL | 26 | 3 Note B | MIL-STD-750-1 Method 1037 |
| 9 | Low Temperature Operating Life | LTOL | 26 | 3 Note B | JESD22-A108 |
| 10a | Electrostatic Discharge Human Body Model | HBM | 10 | 3 | JS-001 |
| 10b | Electrostatic Discharge Charged Device Model | CDM | 10 | 3 | AEC Q101-005 |
| 11 | Destructive Physical Analysis | DPA | 2/试验 | 1 | Appendix 6 |
| 12 | Physical Dimension | PD | 10 | 3 | JESD22-B100 |
| 13 | Terminal Strength | TS | 10 | 3 | MIL-STD-750-2 Method 2036 |
| 14 | Constant Acceleration | CA | 10 | 3 | MIL-STD-750-2 Method 2006 |
| 15 | Vibration Variable Frequency | VVF | JEDEC JESD22-B103 | ||
| 16 | Mechanical Shock | MS | JEDEC JESD22-B104 | ||
| 17 | Hermeticity | HER | JESD22-A109 | ||
| 18a | Resistance to Solder Heat | RSH (-reflow) | 10 | 3 | 含铅：闯贰厂顿22-础113、闯-厂罢顿-020 |
| 无铅：础贰颁-蚕005 | |||||
| 18b | Resistance to Solder Heat | RSH (-wave) | 10 | 3 | 含铅：闯贰厂顿22-叠106 |
| 无铅：础贰颁-蚕005 | |||||
| 19 | Solderability | SD | 10 | 3 | 含铅：闯-厂罢顿-002、闯贰厂顿22-叠102 |
| 无铅：础贰颁-蚕005 | |||||
| 20 | Pulsed Operating Life | PLT | 26 | 3 | JESD22-A108 |
| 21 | Dew | DEW | 26 | 3 | JESD22-A100 |
| 22 | Hydrogen Sulphide | H2S | 26 | 3 | IEC 60068-2-43 |
| 23 | Flowing Mixed Gas | FMG | 26 | 3 | IEC 60068-2-60 Test method 4 |
| 24 | Thermal Resistance | TR | 10 | 1 | 闯贰厂顿51-50、闯贰厂顿51-51、闯贰厂顿51-52 |
| 25 | Wire Bond Pull | WBP | 10 | 3 | MIL-STD-750-2 Method 2037 |
| 26 | Wire Bond Shear | WBS | 10 | 3 | AEC Q101-003 |
| 27 | Die Shear | DS | 5 | 3 | MIL-STD-750-2 Method 2017 |
| 28 | Whister Growth | WG | / | / | AEC Q005 |
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